US Patent 9704843 Integrated system and method of making the integrated system
Patent 9704843 was granted and assigned to Infineon Technologies on July, 2017 by the United States Patent and Trademark Office.
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A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads.
US Patent 09704843 Integrated system and method of making the integrated system US Patent 9704843 Integrated system and method of making the integrated system
US Patent 09704843 Integrated system and method of making the integrated system
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