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US Patent 9741854 Method for manufacturing semiconductor device
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Patent
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Date Filed
December 4, 2015
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Date of Patent
August 22, 2017
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Patent Applicant
Samsung
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Patent Application Number
14959457
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Patent Citations Received
US Patent 11854903 Footing removal in cut-metal process
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Patent Inventor Names
Jae Hyoung Koo
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Do Hyoung Kim
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Myeong Cheol Kim
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Seung Ju Park
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Seung Seok Ha
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Keun Hee Bai
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Ki Byung Park
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Kyoung Hwan Yeo
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
9741854
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Patent Primary Examiner
Calvin Choi
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