Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sinan Goktepeli0
Date of Patent
September 5, 2017
0Patent Application Number
151899160
Date Filed
June 22, 2016
0Patent Citations Received
Patent Primary Examiner
0
Patent abstract
An integrated radio frequency (RF) circuit structure may include an active device on a first surface of an isolation layer. The integrated RF circuit structure may also include backside metallization on a second surface opposite the first surface of the isolation layer. A body of the active device is biased by the backside metallization. The integrated RF circuit structure may further include front-side metallization coupled to the backside metallization with a via. The front-side metallization is arranged distal from the backside metallization. The front-side metallization, the via, and the backside metallization may at least partially enclose the active device.
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