Patent 9761599 was granted and assigned to Micron Technology on September, 2017 by the United States Patent and Trademark Office.
Some embodiments include an integrated structure having a stack of alternating dielectric levels and conductive levels, and having vertically-stacked memory cells within the conductive levels. An opening extends through the stack. Channel material is within the opening and along the memory cells. At least some of the channel material contains germanium.