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US Patent 9768033 Methods for high precision etching of substrates

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 2, 2015
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Date of Patent
September 19, 2017
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Patent Application Number
14790891
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Patent Citations Received
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US Patent 11963287 Systems, devices, and methods for starting plasma
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US Patent 12094688 Plasma apparatus and methods for processing feed material utilizing a powder ingress preventor (PIP)
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US Patent 11855278 Microcomposite alloy structure
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US Patent 11919071 Systems and methods for synthesis of spheroidized metal powders
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US Patent 11839919 Spheroidal dehydrogenated metals and metal alloy particles
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Patent Inventor Names
Mingmei Wang
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Alok Ranjan
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Peter L. G. Ventzek
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
9768033
0
Patent Primary Examiner
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Jiong-Ping Lu
0

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