Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Naohide Takamoto0
Ryuichi Kimura0
Date of Patent
September 19, 2017
0Patent Application Number
151688470
Date Filed
May 31, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
It is an object of the present invention to provide a film for semiconductor back surface having reworkability, and an application of the film. A film for semiconductor back surface has: an adhering strength at 70° C. of 7 N/10 mm or less to a wafer before the film is thermally cured; and a rupture elongation at 25° C. of 700% or less. The film for semiconductor back surface preferably has a degree of swelling due to ethanol of 1% by weight or more. The film for semiconductor back surface preferably contains an acrylic resin.
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