Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cheng-Ting Chen0
Hsiu-Jen Lin0
Meng-Tse Chen0
Ming-Da Cheng0
Chih-Wei Lin0
Chung-Shi Liu0
Date of Patent
September 19, 2017
Patent Application Number
13460412
Date Filed
April 30, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.
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