US Patent 9769929 Interconnect structures for electronic devices with component arrays

An array of electrical components may be mounted in openings in an electronic device housing. The housing may have a cylindrical shape or other curved shape. A support structure such as a hollow cylindrical tube may be mounted within the interior of the housing. The electrical components may have terminals that mate with corresponding contacts on a flexible printed circuit. Interconnect paths on the flexible printed circuit may be used to route signals for the electrical components. The flexible printed circuit may be wrapped into the shape of a cylindrical tube and may be mounted on an interior surface of the cylindrical housing or on the exterior surface of the support structure.