Patent attributes
A method of fabricating a packaging substrate having an embedded through-via interposer is provided. The method includes providing a through-via interposer having opposite first and second sides and conductive through-vias in communication with the first and second sides, wherein each of the conductive through-vias has a first end surface on the first side and a second end surface on the second side, and the second end surfaces protrude below the second side to serve as conductive bumps. Next, forming a redistribution layer on the first side and the first end surfaces such that the redistribution layer electrically connects with the first end surfaces. Afterwards, forming an encapsulant layer to encapsulate and embed the through-via interposer, wherein the encapsulant layer has opposite first and second surfaces. Next, forming a built-up structure on the second surface of the encapsulant layer, the second side of the through-via interposer and the conductive bumps.
