Patent attributes
A wiring substrate includes a core substrate and a cavity extending through the core substrate. The cavity has a planar shape that is rectangular, and includes corners and sides connecting the corners in a plan view. The wiring substrate also includes first through holes that extend through the core substrate and are spaced apart from the cavity. An electronic component is arranged in the cavity. The wiring substrate also includes a first insulating material with which the first through holes are filled and a second insulating material with which a gap between the electronic component and walls of the cavity is filled. The first through holes are arranged around the corners of the cavity in a plan view. Each of the first through holes is L-shaped in a plan view and formed continuously along two of the sides of the cavity that define the corresponding corner.
