Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chi-Jung Lee0
Tien-Chung Yang0
An-Jhih Su0
Wei-Yu Chen0
Hsien-Wei Chen0
Li-Hsien Huang0
Date of Patent
October 31, 2017
Patent Application Number
15153368
Date Filed
May 12, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
Multi-stack package-on-package structures are disclosed. In a method, a first stacked semiconductor device is formed on a first carrier wafer. The first stacked semiconductor device is singulated. The first stacked semiconductor device is adhered to a second carrier wafer. A second semiconductor device is attached on the first stacked semiconductor device. The second semiconductor device and the first stacked semiconductor device are encapsulated. Electrical connections are formed on and electrically coupled to the first stacked semiconductor device and the second semiconductor device.
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