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US Patent 9812402 Wire bond wires for interference shielding
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Patent
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Date Filed
November 7, 2016
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Date of Patent
November 7, 2017
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Patent Application Number
15344990
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Patent Citations Received
US Patent 11973010 Chip packaging method and chip package unit
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US Patent 12075734 Volumetric budget based irrigation control
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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate
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Patent Inventor Names
Abiola Awujoola
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Ashok S. Prabhu
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Wael Zohni
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Willmar Subido
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Zhuowen Sun
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
9812402
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Patent Primary Examiner
S. V. Clark
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