US Patent 9832867 Embedded metallic structures in glass
Patent 9832867 was granted and assigned to Medtronic on November, 2017 by the United States Patent and Trademark Office.
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A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.
US Patent 09832867 Embedded metallic structures in glass US Patent 9832867 Embedded metallic structures in glass
US Patent 09832867 Embedded metallic structures in glass
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