Create
Log in
Sign up
Golden has been acquired by ComplyAdvantage.
Read about it here ⟶
US Patent 9837292 Underfill dispensing with controlled fillet profile
Overview
Structured Data
Issues
Contributors
Activity
Access by API
Access by API
Is a
Patent
0
Date Filed
November 2, 2015
0
Date of Patent
December 5, 2017
0
Patent Application Number
14930032
0
Patent Citations Received
US Patent 11715928 Decoupling layer to reduce underfill stress in semiconductor devices
0
Patent Inventor Names
Chun-Chih Chuang
0
Tsung-Ding Wang
0
Jung Wei Cheng
0
Chun-Hung Lin
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
9837292
0
Patent Primary Examiner
Robert B. Davis
0
Find more entities like US Patent 9837292 Underfill dispensing with controlled fillet profile
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Company
Home
Press & Media
Blog
Careers
WE'RE HIRING
Products
Knowledge Graph
Query Tool
Data Requests
Knowledge Storage
API
Pricing
Enterprise
ChatGPT Plugin
Legal
Terms of Service
Enterprise Terms of Service
Privacy Policy
Help
Help center
API Documentation
Contact Us
SUBSCRIBE