US Patent 9837314 Self-alignment of metal and via using selective deposition
Patent 9837314 was granted and assigned to Tokyo Electron on December, 2017 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 2, 2017
0
Date of Patent
December 5, 2017
0
Patent Application Number
15423320
0
Patent Citations Received
Patent Inventor Names
Jeffrey Smith
0
Anton J. deVilliers
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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