An electrical connector for electrically conducting a chip module to a circuit board. At least one pad is disposed on the circuit board. The electrical connector includes an insulating body for sustaining the chip module, multiple signal terminals disposed in the insulating body and electrically conducting the chip module, and a first shielding sheet and a second shielding sheet respectively located on two adjacent sides of the signal terminals. The first shielding sheet and the second shielding sheet are connected to the same pad.