Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 19, 2017
Patent Application Number
12415510
Date Filed
March 31, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.

