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US Patent 9845520 Beryllium-free high-strength copper alloys

Patent 9845520 was granted and assigned to Questek Innovations Llc on December, 2017 by the United States Patent and Trademark Office.

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Current Assignee
Questek Innovations Llc
Questek Innovations Llc
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9845520
Date of Patent
December 19, 2017
Patent Application Number
12415510
Date Filed
March 31, 2009
Patent Citations Received
‌
US Patent 12076788 Powder feedstock for wear resistant bulk welding configured to optimize manufacturability
0
‌
US Patent 11939646 Corrosion and wear resistant nickel based alloys
0
Patent Primary Examiner
‌
Rebecca Lee
Patent abstract

A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

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