US Patent 9846674 Monolithically integrated system on chip for silicon photonics
Patent 9846674 was granted and assigned to Inphi Corporation on December, 2017 by the United States Patent and Trademark Office.
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In an example, the present invention includes an integrated system on chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member and configured for a predefined data rate and protocol. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The input/output block comprises a SerDes block, a CDR block, a compensation block, and an equalizer block. In an example, the SerDes block is configured to convert a first data stream of N into a second data stream of M such that each of the first data stream having a first predefined data rate at a first clock rate and each of the second data stream having a second predefined data rate at a second clock rate. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device.
US Patent 09846674 Monolithically integrated system on chip for silicon photonics US Patent 9846674 Monolithically integrated system on chip for silicon photonics
US Patent 09846674 Monolithically integrated system on chip for silicon photonics
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