US Patent 9847243 Debonding a glass substrate from carrier using ultrasonic wave
Patent 9847243 was granted and assigned to Corning on December, 2017 by the United States Patent and Trademark Office.
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Patent abstract
A process for making a device comprising a thin functional substrate comprising bonding the functional substrate to a carrier substrate, forming functional components on the functional subsrate, and debonding the functional substrate from the carrier substrate by applying ultrasonic wave to the bonding interface. The application of ultrasonic wave aids the debonding step by reducing the tensile stress the functional substrate may experience.
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US Patent 09847243 Debonding a glass substrate from carrier using ultrasonic wave US Patent 9847243 Debonding a glass substrate from carrier using ultrasonic wave
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Patent Number
0984724300
Patent Number
984724300
Edits on 23 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
098472430
Date of Patent
December 19, 2017
0Patent Application Number
125486850
Date Filed
August 27, 2009
0Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
098472430
Date of Patent
December 19, 2017
0Patent Application Number
125486850
Date Filed
August 27, 2009
0Patent Primary Examiner
Edits on 16 Jan, 2022
Golden AI
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Infobox (+8 properties)
US Patent 09847243 Debonding a glass substrate from carrier using ultrasonic wave
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
09847243
Date of patent
December 19, 2017
Patent application number
12548685
Date Filed
August 27, 2009
Patent primary examiner
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