US Patent 9852995 Semiconductor device

A semiconductor device includes a first semiconductor chip having a first surface with a semiconductor element and a second surface opposing the first surface. A first metal layer has a third surface supporting the first semiconductor chip and a fourth surface opposing the third surface. The third surface is larger than the second surface. A resin layer has a fifth surface facing the first semiconductor chip and a sixth surface facing the first metal layer. A pad is on the first surface of the first semiconductor chip. A first via contact is within the resin layer on the third surface of the first metal layer. A second via contact is within the resin layer on the pad. The first and second via contacts are connected to first and the second interconnects, respectively.