US Patent 9859232 Semiconductor package device and method of manufacturing the same

The present disclosure provides a semiconductor package device comprising a substrate, a semiconductor device, a first electronic component, an antenna pattern and a first package body. The substrate has a first area and a second area. The semiconductor device is disposed on the first area of the substrate. The first electronic component is disposed on the second area of the substrate. The antenna pattern is disposed on the second area of the substrate and electrically connected to the first electronic component. The first package body encapsulates the first area of the substrate and the semiconductor device and exposes the antenna pattern, the first electronic component and the second area of the substrate.