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US Patent 9864133 Silicon photonic chip with through VIAS
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Patent
Date Filed
July 13, 2016
Date of Patent
January 9, 2018
Patent Application Number
15208658
Patent Citations Received
US Patent 11782225 Multi-fiber interface apparatus for photonic integrated circuit
US Patent 12124087 Wideband surface coupling
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US Patent 11852876 Optical coupling
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US Patent 11693200 Double bonding when fabricating an optical device
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US Patent 11841531 Wafer scale bonded active photonics interposer
0
Patent Inventor Names
Mark Webster
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Mary Nadeau
0
Ravi Tummidi
0
Vipulkumar Patel
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9864133
Patent Primary Examiner
Ryan Lepisto
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