Patent attributes
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a substrate, a plurality of gates and a plurality of plugs. The gates are disposed on the substrate and extend in a first direction. The gates include a first gate and a second gate. The first gate includes a first protruding portion extending in a second direction. The plugs are disposed parallel to one another on the substrate. The plugs include a first plug and a second plug. The first plug and the second plug cover the first gate and the second gate respectively. A central axis of the first plug is shifted from a central axis of the first gate toward the second direction, and a central axis of the second plug is shifted from a central axis of the second gate toward the second direction.