US Patent 9885502 Methods and systems for solid state heat transfer
Patent 9885502 was granted and assigned to The Aerospace Corporation on February, 2018 by the United States Patent and Trademark Office.
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Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
US Patent 09885502 Methods and systems for solid state heat transfer US Patent 9885502 Methods and systems for solid state heat transfer
US Patent 09885502 Methods and systems for solid state heat transfer
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