Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 13, 2018
Patent Application Number
15010162
Date Filed
January 29, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
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