US Patent 9905526 Electronic component package and method of manufacturing the same
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Patent abstract
An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.
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Patent Inventor Names
Ji Hoon Kim0
Kyoung Moo Harr0
Kyung Seob Oh0
Sun Ho Kim0
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US Patent 09905526 Electronic component package and method of manufacturing the same US Patent 9905526 Electronic component package and method of manufacturing the same
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Patent Number
099055260
Patent Number
99055260
Edits on 26 Sep, 2022
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Patent Jurisdiction
Patent Number
099055260
Date of Patent
February 27, 2018
0Patent Application Number
151926340
Date Filed
June 24, 2016
0Patent Primary Examiner
Edits on 19 Jan, 2022
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Infobox (+7 properties)
US Patent 09905526 Electronic component package and method of manufacturing the same
Infobox
Is a
Patent jurisdiction
Patent number
09905526
Date of patent
February 27, 2018
Patent application number
15192634
Date Filed
June 24, 2016
Patent primary examiner
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