US Patent 9916090 Techniques for dynamically adjusting slice size

Described are techniques for determining slice sizes. First I/O workload information is received for a slice having a corresponding logical address subrange of a logical address range of a logical device. The corresponding logical address subrange is a first size denoting a size of the slice at a first point in time when the slice has a current I/O workload denoted by the first I/O workload information. It is determined, in accordance with the first I/O workload information, whether to adjust the size of the slice. Responsive to determining to adjust the size of the slice, first processing is performed that adjusts the size of the slice such as by partitioning the slice or merging the slice with one or more other adjacent slices.