US Patent 9929113 Semiconductor package and manufacturing method thereof
Patent 9929113 was granted and assigned to Amkor Technology on March, 2018 by the United States Patent and Trademark Office.
All edits
Edits on 13 Dec, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 7 Dec, 2023
Golden AI
Edits made to:
Article (+399 characters)
Article
Patent abstract
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.
Edits on 1 Oct, 2023
Golden AI
Edits made to:
Infobox (+2 properties)
Infobox
Patent Inventor Names
Jong Sik Paek0
No Sun Park0
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 09929113 Semiconductor package and manufacturing method thereof US Patent 9929113 Semiconductor package and manufacturing method thereof
Infobox
Patent Number
099291130
Patent Number
99291130
Edits on 4 Apr, 2023
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
099291130
Date of Patent
March 27, 2018
0Patent Application Number
152897380
Date Filed
October 10, 2016
0Patent Primary Examiner
Edits on 19 Jan, 2022
Golden AI
Edits made to:
Infobox (+9 properties)
US Patent 09929113 Semiconductor package and manufacturing method thereof
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09929113
Date of patent
March 27, 2018
Patent application number
15289738
Date Filed
October 10, 2016
Patent primary examiner
Find more entities like US Patent 9929113 Semiconductor package and manufacturing method thereof
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
