Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 9941251 3DIC packages with heat dissipation structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 6, 2017
Date of Patent
April 10, 2018
Patent Application Number
15425399
Patent Citations Received
‌
US Patent 12021006 Package structure and method and equipment for forming the same
1
‌
US Patent 11769710 Heterogeneous integration module comprising thermal management apparatus
‌
US Patent 11948855 Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
2
Patent Inventor Names
Szu-Po Huang
3
Kim Hong Chen
3
Shin-Puu Jeng
3
Wensen Hung
3
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9941251
Patent Primary Examiner
‌
Telly Green
Industry
Request Data

Find more entities like US Patent 9941251 3DIC packages with heat dissipation structures

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo