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US Patent 9941251 3DIC packages with heat dissipation structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 6, 2017
Date of Patent
April 10, 2018
Patent Application Number
15425399
Patent Citations Received
‌
US Patent 12021006 Package structure and method and equipment for forming the same
1
‌
US Patent 11769710 Heterogeneous integration module comprising thermal management apparatus
‌
US Patent 11948855 Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
2
Patent Inventor Names
Szu-Po Huang
3
Kim Hong Chen
3
Shin-Puu Jeng
3
Wensen Hung
3
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9941251
Patent Primary Examiner
‌
Telly Green

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