Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 10, 2018
Patent Application Number
14936657
Date Filed
November 9, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for processing a semiconductor wafer, the method including: providing a semiconductor wafer including an image sensor pixels layer including a plurality of image sensor pixels, the layer overlaying a wafer substrate; and then bonding the semiconductor wafer to a carrier wafer; and then cutting off a substantial portion of the wafer substrate, and then processing the substantial portion of the wafer substrate for reuse.
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