Patent attributes
A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a combined component accommodated in the cavity of the substrate, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, and a filling resin filling gap formed between the cavity and combined component accommodated in the cavity of the substrate. The combined component includes an electronic component and a metal block, the electronic component has terminal surface on side facing the first surface of the substrate, and the metal block is superposed to surface of the electronic component on the opposite side of the electronic component with respect to the terminal surface.
