US Patent 9960014 Plasma etching method
Patent 9960014 was granted and assigned to Hitachi on May, 2018 by the United States Patent and Trademark Office.
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In the plasma etching method, a sample is placed on a stage in a chamber. A first gas is introduced into the chamber. Electric field is supplied within the chamber to plasma is generated from the first gas. A first RF power of a first frequency, which is for generating a bias voltage in the sample for etching the sample with radicals which are generated in the plasma while the plasma is generated, is supplied to the stage. A second gas is introduced from a position in outer periphery of a surface of the stage, on which the sample is placed. A second RF power of a second frequency higher than the first frequency and capable of generating plasma from the second gas above the stage that allows radicals generated in the plasma generated from the second gas to be supplied in the outer periphery, is supplied to the stage.
US Patent 09960014 Plasma etching method US Patent 9960014 Plasma etching method
US Patent 09960014 Plasma etching method
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