US Patent 9960098 Systems and methods for thermal conduction using S-contacts

An integrated circuit architecture that provides a path having relatively low thermal resistance between one or more electronic devices and one or more thermal structures formed on an insulator layer on a substrate. Independent parallel thermal conduction paths are provided through the insulator layer, such as a buried oxide (“BOX”) layer, to allow heat to flow from the substrate layer to a thermal structure disposed upon the BOX layer. In some cases, the substrate is a silicon substrate layer supporting the thermal structure and a heat source, such as an electronic device (e.g., power amplifier, transistor, diode, resistor, etc.).