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US Patent 9960129 Hybrid bonding mechanisms for semiconductor wafers
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Patent
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Date Filed
August 20, 2015
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Date of Patent
May 1, 2018
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
14830820
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Patent Citations Received
US Patent 11929347 Mixed exposure for large die
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US Patent 11756880 Interconnect structures
US Patent 11749645 TSV as pad
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12125784 Interconnect structures
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US Patent 11955445 Metal pads over TSV
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US Patent 11804377 Method for preparing a surface for direct-bonding
Patent Inventor Names
Chih-Hui Huang
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Chen-Jong Wang
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Chia-Shiung Tsai
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Lan-Lin Chao
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Ping-Yin Liu
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Szu-Ying Chen
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Xiaomeng Chen
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Xin-Hua Huang
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Yeur-Luen Tu
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
9960129
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Patent Primary Examiner
Steven Loke
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