Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 8, 2018
Patent Application Number
14716515
Date Filed
May 19, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.
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