US Patent 9966300 Semiconductor device package and manufacturing method thereof
Patent 9966300 was granted and assigned to Amkor Technology on May, 2018 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 28, 2015
Date of Patent
May 8, 2018
Patent Applicant
Patent Application Number
14698634
Patent Citations Received
Patent Inventor Names
Michael G. Kelly
0
Won Chul Do
0
David Jon Hiner
0
Ronald Patrick Huemoeller
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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