Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Benjamin D. Briggs0
Huai Huang0
Lawrence A. Clevenger0
Michael Rizzolo0
Christopher J. Penny0
Hosadurga K. Shobha0
Date of Patent
May 8, 2018
Patent Application Number
15459684
Date Filed
March 15, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A wafer is provided. The wafer includes a dielectric layer, first and second metallization layer interconnects arrayed across the dielectric layer with the second metallization layer interconnects adjacent one another and surrounded by the first metallization layer interconnects and a cap. The first and second metallization layer interconnects have respective upper surfaces defining a first plane and a second plane recessed from the first plane, respectively. The cap is disposed on exposed surfaces of the second metallization layer interconnects and portions of the dielectric layer adjacent to the second metallization layer interconnects.
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