Patent attributes
There is provided a test module for testing a fingerprint sensing device comprising: an electrically conductive bottom element comprising an exterior surface portion configured to contact a sensing surface of the fingerprint sensing device; an electrically conductive intermediate element, connected to the bottom element on a side opposing the exterior surface, the intermediate element comprising a flexible material enabling the bottom element to change alignment in response to an applied force occurring when the exterior surface is pressed against a surface being tilted with respect to the exterior surface of the bottom element; and a top element configured connect the test module to a test fixture. There is also provided a method for testing a fingerprint sensing device using the described test module.