US Patent 9991147 Wafer grounding and biasing method, apparatus, and application
Is a
Date Filed
November 3, 2014
0
Date of Patent
June 5, 2018
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Patent Application Number
14531263
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Patent Citations Received
Patent Inventor Names
Kenichi Kanai
0
Juying Dou
0
Yi-Xiang Wang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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