US Patent 9998401 Architecture for on-die interconnect
Patent 9998401 was granted and assigned to Intel on June, 2018 by the United States Patent and Trademark Office.
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In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.
US Patent 09998401 Architecture for on-die interconnect US Patent 9998401 Architecture for on-die interconnect
US Patent 09998401 Architecture for on-die interconnect
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