Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Janet Heyen0
David Ciufo0
Date of Patent
June 12, 2018
0Patent Application Number
149313560
Date Filed
November 3, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.
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