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US Patent D527751 Transfer-chamber

Patent D527751 was granted and assigned to Tokyo Electron on September, 2006 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Hiroshi Narushima0

Keisuke Kondoh0

Hiroki Oka0

Date of Patent

September 5, 2006

Patent Application Number

29217729

Date Filed

November 22, 2004

Patent Citations Received

US Patent 12080571 Substrate processing module and method of moving a workpiece

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US Patent D991994 Mainframe of substrate processing system

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US Patent D992611 Mainframe of substrate processing system

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US Patent 11749542 Apparatus, system, and method for non-contact temperature monitoring of substrate supports

US Patent D1029066 Mainframe of dual-robot substrate processing system

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US Patent 12002668 Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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US Patent 11674227 Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure

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Patent Primary Examiner

Antoine D. Davis

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