US Patent D553572 Module assembly

Is a

Patent Jurisdiction

Patent Number

Patent Inventor Names

William J. Lewis0

George Youhzi Yi0

Hsi-sheng Chen0

Hung-Ting Lin0

Kuang Hsin Hsu0

Date of Patent

October 23, 2007

Patent Application Number

29215156

Date Filed

October 14, 2004

Patent Primary Examiner

No article content yet.

No Timeline data yet.

Title

Author

Link

Type

Date

No Further Resources data yet.

Find more entities like US Patent D553572 Module assembly

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.