US Patent D700864 Module assembly

Patent D700864 was granted and assigned to Suunto on March, 2014 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Suunto

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

D700864

Patent Inventor Names

Kimmo Pernu0

Tapio Selby0

Timo Yliluoma0

Date of Patent

March 11, 2014

Patent Application Number

29434371

Date Filed

October 12, 2012

Patent Citations Received

‌

US Patent D1010695 Communication module housing

Patent Primary Examiner

‌

T Chase Nelson

No article content yet.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent D700864 Module assembly

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API