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US Patent D755741 Power device package
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Patent
Date Filed
February 18, 2015
Date of Patent
May 10, 2016
Patent Application Number
29517863
Patent Citations Received
US Patent 11924996 Liquid-cooling devices, and systems, to cool multi-chip modules
0
Patent Inventor Names
Atapol Prajuckamol
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Yushuang Yao
0
Chee Hiong Chew
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
D755741
Patent Primary Examiner
Elizabeth J Oswecki
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