US Patent D823814 Contact wafer
Patent D823814 was granted and assigned to Samtec Inc on July, 2018 by the United States Patent and Trademark Office.
All edits
Edits on 31 Oct, 2024
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 1 Oct, 2023
Golden AI
Edits made to:
Infobox (+2 properties)
Infobox
Patent Inventor Names
John A. Mongold0
Jonathan E. Buck0
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent D0823814 Contact wafer US Patent D823814 Contact wafer
Infobox
Patent Number
D08238140
Patent Number
D8238140
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
D08238140
Date of Patent
July 24, 2018
0Patent Application Number
296116550
Date Filed
July 24, 2017
0Patent Primary Examiner
Edits on 21 Jan, 2022
Golden AI
Edits made to:
Infobox (+9 properties)
US Patent D0823814 Contact wafer
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
D0823814
Date of patent
July 24, 2018
Patent application number
29611655
Date Filed
July 24, 2017
Patent primary examiner
Find more entities like US Patent D823814 Contact wafer
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
