US Patent D865695 High density fiber enclosure
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Patent Inventor Names
Wei Xiang0
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US Patent D0865695 High density fiber enclosure US Patent D865695 High density fiber enclosure
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Patent Number
D08656950
Patent Number
D8656950
Edits on 26 Sep, 2022
Golden AI
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Patent Jurisdiction
Patent Number
D08656950
Date of Patent
November 5, 2019
0Patent Application Number
296505970
Date Filed
June 7, 2018
0Patent Citations
Patent Primary Examiner
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US Patent D0865695 High density fiber enclosure
Infobox
Is a
Patent jurisdiction
Patent number
D0865695
Date of patent
November 5, 2019
Patent application number
29650597
Date Filed
June 7, 2018
Patent citations
Patent primary examiner
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