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US Patent D920265 Integrated circuit package
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Patent
Date Filed
March 17, 2020
Date of Patent
May 25, 2021
Patent Application Number
29728331
Patent Citations
US Patent 10685896 Integrated circuit package and method of fabricating the same
US Patent 10867879 Integrated circuit package and method
US Patent 10790162 Integrated circuit package and method
US Patent 10134685 Integrated circuit package and method of fabricating the same
0
US Patent 10615151 Integrated circuit multichip stacked packaging structure and method
US Patent 10636757 Integrated circuit component package and method of fabricating the same
Patent Inventor Names
YiWei Huang
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
D920265
Patent Primary Examiner
Elizabeth J Oswecki
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