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US Patent D920266 Integrated circuit package
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Edits on 10 Oct, 2023
"Add patent inventor(s)"
Golden AI
edited on 10 Oct, 2023
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Inventor Names
Jian Wei Yang
0
Edits on 23 May, 2023
"Remove leading 0 from patent number"
Golden AI
edited on 23 May, 2023
Edits made to:
Infobox
(
+1
/
-1
properties)
US Patent D0920266 Integrated circuit package
US Patent D920266 Integrated circuit package
Infobox
Patent Number
D0920266
0
0
Patent Number
D920266
0
0
Edits on 20 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 20 May, 2023
Edits made to:
Infobox
(
-1
properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=D0920266
0
0
Edits on 27 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 27 Apr, 2023
Infobox
Patent Citations
US Patent 10134685 Integrated circuit package and method of fabricating the same
0
Edits on 4 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 4 Apr, 2023
Infobox
Patent Citations
US Patent 10636757 Integrated circuit component package and method of fabricating the same
0
Edits on 2 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 2 Apr, 2023
Infobox
Patent Citations
US Patent 10867879 Integrated circuit package and method
0
Edits on 28 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 28 Mar, 2023
Infobox
Patent Citations
US Patent 10615151 Integrated circuit multichip stacked packaging structure and method
0
Edits on 27 Mar, 2023
"Entity importer update"
Golden AI
edited on 27 Mar, 2023
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
D0920266
0
Date of Patent
May 25, 2021
0
Patent Application Number
29728332
0
Date Filed
March 17, 2020
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=D0920266
0
Patent Citations
US Patent 10134685 Integrated circuit package and method of fabricating the same
0
US Patent 10615151 Integrated circuit multichip stacked packaging structure and method
0
US Patent 10636757 Integrated circuit component package and method of fabricating the same
0
US Patent 10685896 Integrated circuit package and method of fabricating the same
0
US Patent 10790162 Integrated circuit package and method
0
US Patent 10867879 Integrated circuit package and method
0
Patent Primary Examiner
Elizabeth J Oswecki
0
Edits on 27 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 27 Sep, 2022
Infobox
Patent Citations
US Patent 10867879 Integrated circuit package and method
0
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 25 Sep, 2022
Infobox
Patent Citations
US Patent 10636757 Integrated circuit component package and method of fabricating the same
0
"update citations for inverse infoboxes"
Golden AI
edited on 25 Sep, 2022
Infobox
Patent Citations
US Patent 10615151 Integrated circuit multichip stacked packaging structure and method
0
Edits on 22 Sep, 2022
"Entity importer update"
Golden AI
edited on 22 Sep, 2022
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
D0920266
0
Date of Patent
May 25, 2021
0
Patent Application Number
29728332
0
Date Filed
March 17, 2020
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=D0920266
0
Patent Citations
US Patent 10134685 Integrated circuit package and method of fabricating the same
0
US Patent 10615151 Integrated circuit multichip stacked packaging structure and method
0
US Patent 10636757 Integrated circuit component package and method of fabricating the same
0
US Patent 10685896 Integrated circuit package and method of fabricating the same
0
US Patent 10790162 Integrated circuit package and method
0
US Patent 10867879 Integrated circuit package and method
0
Patent Primary Examiner
Elizabeth J Oswecki
0
Edits on 6 Jun, 2022
"Entity importer update"
Golden AI
edited on 6 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=D0920266
Edits on 12 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 12 Feb, 2022
Edits made to:
Infobox
(
+13
properties)
US Patent D0920266 Integrated circuit package
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
D0920266
Date of patent
May 25, 2021
Patent application number
29728332
Date Filed
March 17, 2020
Patent citations
US Patent 10134685 Integrated circuit package and method of fabricating the same
US Patent 10615151 Integrated circuit multichip stacked packaging structure and method
US Patent 10636757 Integrated circuit component package and method of fabricating the same
US Patent 10685896 Integrated circuit package and method of fabricating the same
US Patent 10790162 Integrated circuit package and method
US Patent 10867879 Integrated circuit package and method
Patent primary examiner
Elizabeth J Oswecki
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