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US Patent D973200 Bond pattern for substrate
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Edits on 13 Jun, 2024
"update inverses"
Golden AI
edited on 13 Jun, 2024
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Patent Citations Received
US Patent D1031026 Bond pattern for substrate
0
Edits on 22 May, 2024
"update inverses"
Golden AI
edited on 22 May, 2024
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+1
properties)
Infobox
Patent Citations Received
US Patent 11986379 Bond pattern
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Edits on 14 Aug, 2023
"Add patent inventor"
Golden AI
edited on 14 Aug, 2023
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+6
properties)
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Patent Inventor Names
Christopher Colin Arp
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Joseph Leslie Grolmes
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Matthew Steven Ritter
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Michael Joseph Page
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Ray Dennis Dria
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Scott Alan King
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Edits on 20 May, 2023
"Remove leading 0 from patent number"
Golden AI
edited on 20 May, 2023
Edits made to:
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+1
/
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US Patent D0973200 Bond pattern for substrate
US Patent D973200 Bond pattern for substrate
Infobox
Patent Number
D0973200
0
0
Patent Number
D973200
0
0
Edits on 31 Mar, 2023
"Entity importer update"
Golden AI
edited on 31 Mar, 2023
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
D0973200
0
Date of Patent
December 20, 2022
0
Patent Application Number
29807499
0
Date Filed
September 13, 2021
0
Patent Primary Examiner
Samantha Q Lawrence
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CPC Code
A61F 13/476
0
A61F 13/4704
0
A61F 13/15
0
A61F 13/64
0
A61F 13/5611
0
Edits on 21 Dec, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 21 Dec, 2022
Edits made to:
Infobox
(
+12
properties)
US Patent D0973200 Bond pattern for substrate
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
D0973200
0
Date of Patent
December 20, 2022
0
Patent Application Number
29807499
0
Date Filed
September 13, 2021
0
Patent Primary Examiner
Samantha Q Lawrence
0
CPC Code
A61F 13/476
0
A61F 13/4704
0
A61F 13/15
0
A61F 13/64
0
A61F 13/5611
0
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